1" Magnetron Sputtering Source with Flexible Head for DIY RF & DC Sputtering Coater - HVMSS-SPC-1-LD

1" Magnetron Sputtering Source with Flexible Head for DIY RF & DC Sputtering Coater - HVMSS-SPC-1-LD
The HVMSS-SPC-1-LD is a magnetron sputtering gun with a flexible head capable of accommodating a wide range of 1" Dia. sputtering sources. Its compatibility with DC, pulsed DC and RF power supplies ensures maximum versatility and extends its usage to various sputtering targets (e.g. metallic, electrically insulating, magnetic or non-magnetic, and etc). Furthermore, its high vacuum design makes the use of Argon under low-pressure levels improves the quality of coating through reducing gas collisions inside the chamber.
Circular rare-earth Nd-Fe-B magnets isolated from cooling water are implemented into the design for minimizing water-to-vacuum interfaces that are typically found in other sputtering sources. These magnets are field replaceable and make the sputtering gun easy to operate and maintain. The installation of this apparatus is straight forward and it also offers simple target changes that do not require any target bonding.
SPECIFICATIONS
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Product Information
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Shipping & Returns
Description
The HVMSS-SPC-1-LD is a magnetron sputtering gun with a flexible head capable of accommodating a wide range of 1" Dia. sputtering sources. Its compatibility with DC, pulsed DC and RF power supplies ensures maximum versatility and extends its usage to various sputtering targets (e.g. metallic, electrically insulating, magnetic or non-magnetic, and etc). Furthermore, its high vacuum design makes the use of Argon under low-pressure levels improves the quality of coating through reducing gas collisions inside the chamber.
Circular rare-earth Nd-Fe-B magnets isolated from cooling water are implemented into the design for minimizing water-to-vacuum interfaces that are typically found in other sputtering sources. These magnets are field replaceable and make the sputtering gun easy to operate and maintain. The installation of this apparatus is straight forward and it also offers simple target changes that do not require any target bonding.
SPECIFICATIONS



































