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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
- Composition: Bismuth Iron Oxide BiFeO3 Target
- 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
- Purity: > 99.99%
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$1,295.00
BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)—
$1,295.00
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
- Composition: Bismuth Iron Oxide BiFeO3 Target
- 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
- Purity: > 99.99%
Related Products
|
|
|
|
|
|
Target A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |