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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD
EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck.
SPECIFICATIONS:
SPECIFICATIONS:
Width |
6.5" |
Thickness |
0.25mm |
Length |
Price sold by 10 feet per quantity |
Item |
It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing. |
Application Notes |
$59.00
Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD—
$59.00
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck.
SPECIFICATIONS:
SPECIFICATIONS:
Width |
6.5" |
Thickness |
0.25mm |
Length |
Price sold by 10 feet per quantity |
Item |
It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing. |
Application Notes |
