EQ-HC-SiN is designed for heating 12mm I.D. Silicon Nitride Pellet Pressing Die with Heating jacket (550°C Max.) and Temperature Controller. Programmable Temperature Controller is standard from 03/09/2021.

SPECIFICATIONS: 

Model	HC12SiN	HC20SiN
Structure	The 12mm SiN Heating Die Set includes: A set of 12mm Silicon Nitride Pellet Pressing Die - Die-SiN Die Sleeve: 30mm O.D. x 12mm I.D. x 40mm H Upper Pushing Rod: 12mm Dia. x 40mm H Lower Rod: 12mm Dia. x 10mm H Mold Release Rod Mold Release Sleeve Upper and Lower Supporting Plate Heat Insulation Plate with mica Heating Jacket: 65mm O.D. x 40mm H Copper Adapter: 39mm O.D. x 30mm I.D. x 40mm H Single Set Point Temperature Controller - MTC1000	The 20mm SiN Heating Die Set includes: A set of 20mm Silicon Nitride Pellet Pressing Die - Die-SiN Pressing Die Sleeve: 40mm O.D. x 20mm I.D. x 40mm H Upper Pushing Rod: 20mm Dia. x 40mm H Lower Rod: 20mm Dia. x 10mm H Mold Release Rod Mold Release Sleeve Upper and Lower Supporting Plate Heat Insulation Plate with mica Heating Jacket Ø58×Ø50×40 mm Copper adapter Ø50×Ø40×40 mm  Single Set Point Temperature Controller - MTC1000
Voltage	AC 220V 50/60Hz (for 110V, please order a 750W transformer)
Power	550W
Working Temperature   and Pressure	Temperature: RT - 500 ºC  Pressure: 100 MPa
Temp. control method	Programmable PID temperature controller with a type-K thermocouple. Temperature Accuracy: +/- 2°C
Application Note	Please always wear protective goggles during the operation !!! The heating and cooling temperature rate should be below 5 °C/min The volume of feeding material should be below 1/3 total volume of Si3N4 sleeve. Over-feeding material may cause damage to the sleeve at high temperatures. Suggest using 32~75 microns particles for pressing (Pic.1) Please clean the mold after the completion of each experiment.