• Precision Polishing Jig for accurate wafer/substrate polishing and back-thinning
• Thickness control screw fixture with a resolution of 0.005 mm to limit stock remove
• This Polishing fixture can be fit with Unipol 1202 and 1502 and any precision 12" or larger polishing machine with yoke support to achieve automatic polishing or lapping
• Super-hard tungsten alloy is welded on the bottom of the jig for polishing resistible
• Maximum sample thickness: 13mm
• Maximum travel distance: 14mm

• The maximum size of a wafer or substrate is 4" diameter
• If the thickness of the sample is greater than 0.15 mm, adopt vacuum absorption. If the thickness is less than 0.15 mm, please use wax

• One digital micrometer is included with a resolution of +/- 1 micron for more accurate lapping.
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• One digital balance is included for measuring the fixture weight ( pressure ) 
• Weight can be adjusted by screws while measuring on the digital balance from 1g to 2000g.

• Require a vacuum pump with a rate > 70 L/ min.
• To protect the vacuum pump from any moisture and liquid, connect the filter between the fixture and the pump
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• Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape
• Then put the 4" blue tape with the wafer to vacuum the chunk

• Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape
• Then put the 4" blue tape with the wafer to vacuum the chunk

A vacuum pump is required for vacuum absorption, please order it separately.

• FYP
• YTP550