
Multi-Blade Low Speed Saw with 6" Cutting Blade for Dicing 4" Wafer - SYJ190
SYJ190 is a multi-blade diamond low-speed precision saw designed for dicing up to 4’ wafer samples. The equipment supports the installation of multiple cutting blades, enabling a wide range of sample materials.
The machine is equipped with a 2D tiltable and adjustable positioning stage and a digital micrometer for accurate sample alignment and positioning. During the operation, a cooling fluid system is applied to dissipate heat generated during the cutting process to minimize thermal damage of the sample.
SPECIFICATION:
| Voltage and Power |
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| Speed Range |
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| Cutting Width & Depth |
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| Blades |
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| Accessories |
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| Certification |
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| Application Note |
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| Warning |
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Original: $14,395.50
-65%$14,395.50
$5,038.42Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
SYJ190 is a multi-blade diamond low-speed precision saw designed for dicing up to 4’ wafer samples. The equipment supports the installation of multiple cutting blades, enabling a wide range of sample materials.
The machine is equipped with a 2D tiltable and adjustable positioning stage and a digital micrometer for accurate sample alignment and positioning. During the operation, a cooling fluid system is applied to dissipate heat generated during the cutting process to minimize thermal damage of the sample.
SPECIFICATION:
| Voltage and Power |
|
| Speed Range |
|
| Cutting Width & Depth |
|
| Blades |
|
| Accessories |
|
| Certification |
|
| Application Note |
|
| Warning |
|






















