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Ge Wafer (100) 2" dia x 1.0 mm, 1SP, N type (Sb doped), resistivities: 0.02 ohm-cm - GEsba50D10c1R002US

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Ge Wafer (100) 2" dia x 1.0 mm, 1SP, N type (Sb doped), resistivities: 0.02 ohm-cm - GEsba50D10c1R002US

Ge Wafer Specification

  • Growing Method:             CZ
  • Orientation:                      (100) +/-0.5 Deg.
  • Wafer Size:                      2" dia x  1000 microns  
  • Surface Polishing:            one side epi polished
  • Surface roughness:          < 8 A ( by AFM)
  • Doping:                           Sb Doped
  • Conductor type:                N-type
  • Resistivity:                     0.02 Ohms/cm
  • EPD:                            
  • Package:                         under 1000 class clean room      

Typical Properties:

  • Structure:                        Cubic, a = 5.6754 Å

  • Density:                          5.323 g/cm3 at room temperature

  • Melting Point:                  937.4 oC

  • Thermal Conductivity:       640

$899.00
Ge Wafer (100) 2" dia x 1.0 mm, 1SP, N type (Sb doped), resistivities: 0.02 ohm-cm - GEsba50D10c1R002US
$899.00

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Description

Ge Wafer Specification

  • Growing Method:             CZ
  • Orientation:                      (100) +/-0.5 Deg.
  • Wafer Size:                      2" dia x  1000 microns  
  • Surface Polishing:            one side epi polished
  • Surface roughness:          < 8 A ( by AFM)
  • Doping:                           Sb Doped
  • Conductor type:                N-type
  • Resistivity:                     0.02 Ohms/cm
  • EPD:                            
  • Package:                         under 1000 class clean room      

Typical Properties:

  • Structure:                        Cubic, a = 5.6754 Å

  • Density:                          5.323 g/cm3 at room temperature

  • Melting Point:                  937.4 oC

  • Thermal Conductivity:       640

Ge Wafer (100) 2" dia x 1.0 mm, 1SP, N type (Sb doped), resistivities: 0.02 ohm-cm - GEsba50D10c1R002US | MTI Online Store